![]() ![]() ![]() Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent.Īll points are true – when dealing with the centre section of the bell curve. Vapor phase, once cast to the annals’ of history is making a comeback. Vapor Phase Technology and its Application The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. Surface Finish Issues Affecting Solderability and ReliabilityĪCI Technologies was contacted in regards to poor solder joint reliability. ![]()
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